HACKINTOSH.ORG | Macintosh discussion forums

Macintosh News => iPhone/iPod/iPad News => Topic started by: HCK on September 17, 2016, 04:05:25 pm



Title: iPhone 7 Teardown Reveals ‘Incredibly Thin’ TSMC Fabricated A10 Fusion Chip, Intel Modem, and 2GB RAM
Post by: HCK on September 17, 2016, 04:05:25 pm
iPhone 7 Teardown Reveals ‘Incredibly Thin’ TSMC Fabricated A10 Fusion Chip, Intel Modem, and 2GB RAM

<img style="float: left; margin-right: 10px"  src="(http://www.iphonehacks.com/wp-content/uploads/2016/09/A10-Fusion-Chip-194x129.jpg)">
The folks over at Chipworks have gotten a close look at the A10 Fusion chip inside an iPhone 7 and have posted some interesting details about it.   
 Continue reading <span class="meta-nav">→</span> (http://www.iphonehacks.com/2016/09/iphone-7-teardown-reveals-incredibly-thin-tsmc-fabricated-a10-fusion-chip-intel-modem.html)

Source: iPhone 7 Teardown Reveals ‘Incredibly Thin’ TSMC Fabricated A10 Fusion Chip, Intel Modem, and 2GB RAM (http://www.iphonehacks.com/2016/09/iphone-7-teardown-reveals-incredibly-thin-tsmc-fabricated-a10-fusion-chip-intel-modem.html)