Kuo: AirPods 3 Could Feature Complex Packaging Solution Like AirPods Pro<img style="float: left; margin-right: 10px" src="
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TF Securities analyst Ming-Chi Kuo believes Apple will switch to a more complicated SiP (System-in-Package) solution for the third-generation AirPods which he had previously claimed will launch early next year. Apple currently uses surface mount technology (SMT) for the second-gen. AirPods.
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Kuo: AirPods 3 Could Feature Complex Packaging Solution Like AirPods Pro
