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Author Topic: iPhone 7 Teardown Reveals ‘Incredibly Thin’ TSMC Fabricated A10 Fusion Chip, Intel Modem, and 2GB RAM  (Read 493 times)
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« on: September 17, 2016, 04:05:25 pm »

iPhone 7 Teardown Reveals ‘Incredibly Thin’ TSMC Fabricated A10 Fusion Chip, Intel Modem, and 2GB RAM

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The folks over at Chipworks have gotten a close look at the A10 Fusion chip inside an iPhone 7 and have posted some interesting details about it.   
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Source: iPhone 7 Teardown Reveals ‘Incredibly Thin’ TSMC Fabricated A10 Fusion Chip, Intel Modem, and 2GB RAM
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