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Macintosh News => Apple News => Topic started by: HCK on December 08, 2010, 07:00:31 am



Title: Samsung unveils '3D' memory modules with 50 percent greater density
Post by: HCK on December 08, 2010, 07:00:31 am
Samsung unveils '3D' memory modules with 50 percent greater density
         


 Samsung announced today that it is ready to release a new set of 8GB DIMMs that takes advantage of stacking memory chips vertically to achieve 30% fewer...



         

http://rss.macworld.com/click.phdo?i=7a3c4904232d4b0d0276bfc3aca84865