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Title: Kuo: AirPods 3 Could Feature Complex Packaging Solution Like AirPods Pro Post by: HCK on July 07, 2020, 04:05:18 pm Kuo: AirPods 3 Could Feature Complex Packaging Solution Like AirPods Pro
<img style="float: left; margin-right: 10px" src="(http://www.iphonehacks.com/wp-content/uploads/2020/03/Apple-AirPods-Pro-194x129.jpg)"> TF Securities analyst Ming-Chi Kuo believes Apple will switch to a more complicated SiP (System-in-Package) solution for the third-generation AirPods which he had previously claimed will launch early next year. Apple currently uses surface mount technology (SMT) for the second-gen. AirPods. Continue reading <span class="meta-nav">→</span> (http://www.iphonehacks.com/2020/07/kuo-airpods-3-feature-design-airpods-pro.html) Source: Kuo: AirPods 3 Could Feature Complex Packaging Solution Like AirPods Pro (http://www.iphonehacks.com/2020/07/kuo-airpods-3-feature-design-airpods-pro.html) |