First iPhone SE Teardown Reveals Mix of iPhone 5s, 6, and 6s ComponentsWith the
iPhone SE now available in several countries, the first teardown of the device has been
conducted by Chipworks. As expected, the device uses a hodgepodge of components sourced from several past iPhones, including the iPhone 5, 6, and 6s, leading Chipworks to say "this is not your typical Apple release."
There are very few new parts, but that hardly means there is no innovation. As is the genius of Apple and its fearless leader, Mr. Cook, it is the combination of all the right parts that make a successful product. Finding that just-right balance of old and new, and at such a low cost, is no easy feat.
The processor inside the iPhone SE is indeed the same A9 processor found in the
iPhone 6s, and the part in the iPhone SE Chipworks took apart was labeled with an APL1022 part number from a TSMC facility. It includes SK Hynix memory, which Chipworks says is likely the same 2GB LPDDR4 DRAM module found in the
iPhone 6s.
<img src="
" alt="applea9chip" width="685" height="175" class="aligncenter size-full wp-image-495958" />
The date codes might actually tell a story: the decapped application processor chip is dated 1535, Aug/Sep last year, so it was sitting in inventory for a while; the memory is 1549, last December; and presumably the whole package-on-package was assembled this year at the end of January.
The NFC chip is the NXP 66V10, the same used in the iPhone 6s, and the 6-axis sensor is from InvenSense and was also used in the iPhone 6s.
The Qualcom MDM9625M modem and the accompanying transceiver were originally found in the iPhone 6, and the Audio ICs, which Chipworks thinks were designed by Cirrus Logic, came from the iPhone 6s.
While many parts were originally from the iPhone 6 or 6s, the touch screen controller components (Broadcom BCM5976 and Texas Instruments 343S0645) were originally used in the
iPhone 5s.
<img src="
" alt="iphonesetouchscreencontroller" width="685" height="170" class="aligncenter size-full wp-image-495959" />
There are a few new components in the iPhone SE, including a "338S00170 device," which Chipworks says is "very likely a new Apple/Dialog power management IC," along with a Skyworks SKY77611 power amplifier module, a 16GB Toshiba NAND flash module, an EPCOS D5255 antenna switch module, and an AAC Technologies microphone.
Additional information about the iPhone SE will come out as Chipworks continues on with its teardown and as other companies like iFixit conduct their own device teardowns. The iPhone SE will be available in the United States starting tomorrow, March 31.
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First iPhone SE Teardown Reveals Mix of iPhone 5s, 6, and 6s Components
