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Author Topic: Apple's fingerprint sensor encapsulation tech could be headed for future iPhone  (Read 458 times)
HCK
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« on: June 20, 2013, 03:01:17 pm »
Apple's fingerprint sensor encapsulation tech could be headed for future iPhone
         

The U.S. Patent and Trademark Office on Thursday published an Apple filing for a unique encapsulation structure which holds both a fingerprint sensor and its conductive bezel, allowing for a smaller, more protective final component suitable for a mobile device.
         

http://appleinsider.com.feedsportal.com/c/33975/f/617028/s/2d8b2167/l/0Lappleinsider0N0Carticles0C130C0A60C20A0Capples0Efingerprint0Esensor0Eencapsulation0Etech0Ecould0Ebe0Eused0Ein0Efuture0Eiphone/story01.htm
         
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